§ 690_690.43

Add sentence to the end of paragraph 2

Devices listed and identified for grounding the metallic frames of PV modules shall be permitted to bond the exposed metallic frames of PV modules to grounded mounting structures. Devices identified and listed for bonding the metallic frames of PV modules shall be permitted to bond the exposed metallic frames of PV modules to the metallic frames of adjacent PV modules. Conductors used to bond metallic frames of PV modules shall be solid copper type.

Chapter 7. Special Conditions

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